固化是指在电子行业及其它各种行业中，为了增强材料结合的应力而采用的零部件加热、树脂固化和烘干的生产工艺。实施固化的容器即为固化炉。
Curing refers to the production process of heating components, resin curing, and drying adopted in the electronics industry and various other industries to enhance the stress of material bonding. The container used for implementing curing is known as a curing oven.
固化是指在电子行业及其它各种行业中，为了增强材料结合的应力而采用的零部件加热、树脂固化和烘干的生产工艺。实施固化的容器即为固化炉。 Curing refers to the production process of heating components, resin curing, and drying adopted in the electronics industry and various other industries to enhance the stress of material bonding. The container used for implementing curing is known as a curing oven.
序号 S/N | 型号 Model | 加热功率Heating Power（kW） | 温度均匀度 Temperature Uniformity (±%) | 温度波动度 Temperature Fluctuation (±℃) | 工作室mm （宽*深*高） Work Chamber mm (W*D*H) | 工作温度 Work Temperature (℃) | 电源 Power Supply |
1 | HW-CO-25162020 | 52 | ±3% | ±2℃ | 1600*2000*2000 | RT+20℃~+250℃ | 三相380V 50HZ |
2 | HW-CO-25202020 | 60 | ±3% | ±2℃ | 2000*2000*2000 | ||
3 | HW-CO-25202520 | 66 | ±3% | ±2℃ | 2000*2500*2000 | ||
4 | HW-CO-25203020 | 72 | ±3% | ±2℃ | 2000*3000*2000 | ||
5 | HW-CO-25204020 | 90 | ±3% | ±2℃ | 2000*4000*2000 | ||
6 | HW-CO-25303025 | 108 | ±3% | ±2℃ | 3000*3000*2500 | ||
7 | HW-CO-25304025 | 132 | ±3% | ±2℃ | 3000*4000*2500 | ||
8 | HW-CO-25355030 | 180 | ±3% | ±2℃ | 3500*5000*3000 | ||
9 | HW-CO-25358030 | 336 | ±3% | ±2℃ | 3500*8000*3000 |